With the basic infra structure coming into place it’s time to focus on the scientific challenges to microelectronic packaging. And there are quite a few, as devices miniaturise, power density increase material interfaces becomes more dominant, different physical domains are more intensively coupled. On top of that, not only devices from the electrical domain are integrated in the package, CITC will also work on integrating chips from different domains such as optics.
There are a lot of challenges and opportunities ahead! At CITC we like to call this Challunities.